收藏本站
Philips Semiconductors
PCF8582C-2
256 × 8-bit CMOS EEPROM with I 2 C-bus interface
15. Soldering
15.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for ?ne pitch SMDs. In these situations re?ow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
15.2 Through-hole mount packages
15.2.1
15.2.2
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 ° C or
265 ° C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the speci?ed maximum storage temperature (T stg(max) ).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 ° C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 ° C, contact may be up to 5 seconds.
15.3 Surface mount packages
9397 750 14222
15.3.1
Re?ow soldering
Re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for re?owing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical re?ow peak temperatures range from 215 to 270 ° C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
? below 225 ° C (SnPb process) or below 245 ° C (Pb-free process)
– for all the BGA and SSOP-T packages
? Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 04 — 25 October 2004
16 of 21
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
PCF8594C-2T/02,118 IC EEPROM 4KBIT 100KHZ 8SOIC
PCF8598C-2P/02,112 IC EEPROM 8KBIT 100KHZ 8DIP
PCU9955TW,118 IC LED DRVR CONST CURR
PDA006B-700C LED DRIVER 6W 700MA
PDA010B-700C LED DRIVER 8.4W 700MA
PDA015B-350C LED DRIVER 15W 350MA
PDA030B-700C LED DRIVER 30W 700MA
PDC500-1024F SINGLE OUTPUT 500W 24V
相关代理商/技术参数
PCF8582C-2T/03 制造商:NXP Semiconductors 功能描述:EEPROM SERIAL 2K SMD 8582 SOIC8
PCF8582C-2T/03112 制造商:NXP Semiconductors 功能描述:IC EEPROM 2KBIT I2C 100KHZ SOIC-8
PCF8582C-2T-03 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface
PCF8582E-2 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROMS with I2C-bus interface
PCF8582E2P 制造商:n/a 功能描述:CMOS EEPROM
PCF8582E-2P 制造商:n/a 功能描述:CMOS EEPROM
PCF8582E-2P/03 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:IC
PCF8582E-2T 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROMS with I2C-bus interface